Intel and German Government Partner for Cutting-Edge Wafer Fabrication

Joint Effort for Enhanced Semiconductor Production

Magdeburg to Host Intel's First EUV Production Facility

Berlin, June 19, 2023 – Intel Corporation and the German federal government have signed a revised letter of intent for Intel's planned leading-edge wafer fabrication. This agreement marks a significant step towards establishing a state-of-the-art semiconductor manufacturing hub in Germany, contributing to the global push for chip production resilience.

In March 2022, Intel announced its plans to invest €17 billion in the construction of two semiconductor fabrication plants in Magdeburg, Germany. The company aims to develop first-of-their-kind semiconductor fabs in the initial phase, marking a major milestone in its global expansion strategy.

The Magdeburg facilities will be critical to Intel's plans to begin high-volume production of Intel 4 technology, utilizing EUV lithography for the first time. This advanced technology will enable the production of cutting-edge semiconductors for various applications, including artificial intelligence, edge computing, and automotive electronics.

The partnership between Intel and the German government highlights the importance of a balanced and resilient supply chain for semiconductors. By investing in advanced fabrication capabilities in Europe, Intel is contributing to the region's economic growth and innovation.